Insight into the Mechanical Workings of VITA 93 Quantum Memory Module
Introducing VITA 93 QMC: High-Performance Mezzanine Modules for Rugged Applications
VITA 93 QMC, a new mezzanine card standard developed by the VITA organisation, is set to revolutionise the industry with its compact design and high-speed capabilities. This innovative standard is not limited to military and avionic applications, but is also tailored for rugged or industrial uses.
Compact Design and High Signal Density
The single QMC module measures 26 mm x 78.25 mm with a component height of only 4.7 mm, making it significantly smaller than traditional PMC or XMC modules. This compact footprint allows for modular scalability by accommodating multiple single-function modules on a carrier board.
The QMC modules utilize a pair of 80-pin Samtec AcceleRate HD Ultra-Dense Slim Body connectors with a 0.635 mm pitch. These connectors support stacking or mezzanine mounting with high signal integrity, allowing multiple modules on a carrier for increased functionality and high I/O density.
The I/O connector is organized into five I/O pipes, each having 8 single-ended or 4 differential signals matched with a dedicated ground. This translates to 40 I/O signals per single x1 QMC socket, enabling very high signal density per module.
Flexible Power and Cooling Options
The host connector supplies power rails at 3.3 V and 12 V and supports an I2C interface compliant with the Intelligent Platform Management Interface (IPMI). The data interface supports up to PCI Express Gen 6 speeds and includes additional signals like JTAG.
VITA 93 QMC caters to industrial and rugged applications with flexible cooling options. The modules are designed to support both air-cooled and conduction-cooled mounting methods. The 4.7 mm height is proven sufficient for typical circuit designs in these environments.
Expansion Features and Industrial Applications
Higher versions of VITA 93 QMC modules allow for more components to be placed under them, providing more I/O pins. VITA 93 QMC defines four different size modules, with scaling by width rather than length.
The host side of VITA 93 QMC modules provides power (3.3 V and 12 V) along with an I2C interface that supports the Intelligent Platform Management Interface (IPMI) and will work with the upcoming VITA 100.20 module management system.
The connector used in VITA 93 QMC is rated up to 64-Gb/s PAM4, making it suitable for high-speed serial interfaces like PCI Express Gen 6 and the Compute Express Link (CXL) standard.
In summary, VITA 93 QMC modules are small mezzanine cards (26 mm x 78.25 mm x 4.7 mm) connected via high-speed, dense 80-pin connectors supporting stacking with flexible air or conduction cooling, optimised for rugged, high-density industrial and military applications. The flexible expansion features and tight specifications of VITA 93 QMC make it an ideal choice for a wide range of industrial and commercial applications.
The VITA 93 QMC modules, embedded in rugged or industrial applications, utilize technology that offers a compact design with high signal density, aiding modular scalability and accommodating multiple single-function modules on a carrier board. These modules also incorporate data-and-cloud-computing compatible connectors, able to support high-speed serial interfaces like PCI Express Gen 6 and the Compute Express Link (CXL) standard, ensuring compatibility with cloud-based systems.
