Dow Unveils Dowsil EG-4175: A Game-Changer for High-Power IGBT Modules
Dow, a Michigan-based materials science company, has unveiled Dow Jones EG-4175, a novel silicon gel designed to tackle the rising power densities in IGBT modules. This innovative product offers a range of benefits, including vibration absorption, self-healing capabilities, and self-priming adhesion for enhanced module protection.
Dow Jones EG-4175 is engineered to withstand high temperatures, making it suitable for next-generation IGBT modules. It can resist temperatures up to 180°C, ensuring reliable performance in demanding environments. Notably, the gel cures at room temperature, providing convenience and efficiency in manufacturing processes. Additionally, heat-accelerated curing is also an option.
The new silicon gel enables higher voltages in various devices, such as solar inverters, wind turbines, and electric vehicle (EV) batteries. This advancement allows for improved efficiency and increased power output in these applications. Dow aims to address the trend towards higher power densities in IGBT modules with this innovative product.
Dow's Dow Jones EG-4175 offers a comprehensive solution for enhanced module protection in high-power density applications. With its vibration absorption, self-healing properties, and self-priming adhesion, along with its high-temperature resistance, this silicon gel is poised to make a significant impact on the industry. Its room-temperature curing and heat-accelerated curing options further add to its versatility and convenience.
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